Multilayer electronic component for enhanced moisture resistance and bending strength

ABSTRACT

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application is a Continuation of U.S. patent applicationSer. No. 16/836,125 filed on Mar. 31, 2020 (which is now U.S. Pat. No.11,501,922), which claims the benefit of priority to Korean PatentApplication No. 10-2019-0105819 filed on Aug. 28, 2019 in the KoreanIntellectual Property Office, the entire disclosures of which areincorporated herein by reference.

BACKGROUND 1. Field

The present disclosure relates to a multilayer electronic component.

2. Description of Related Art

A multilayer ceramic capacitor (MLCC), a type of multilayer electroniccomponent, may be a chip type capacitor mounted on a printed circuitboard of various electronic products such as imaging devices includingliquid crystal displays (LCDs), plasma display panels (PDPs), and thelike, and computers, smartphones, mobile phones, and the like, servingto charge or discharge electricity therein or therefrom.

Such multilayer ceramic capacitors may be used as components of variouselectronic devices due to their relatively small size, relatively highcapacitance, and relative ease of mounting. As various electronicdevices such as computers, mobile devices, or the like are miniaturizedand increased in terms of output, demand for miniaturization and highcapacitance of multilayer ceramic capacitors is increasing.

In addition, as recent interest in vehicle electric/electroniccomponents has increased, multilayer ceramic capacitors have also cometo require relatively high reliability and strength characteristics tobe used in vehicle or infotainment systems.

In order to secure high-reliability and high-strength characteristics, amethod of changing a conventional external electrode, including anelectrode layer, to have a double-layer structure including an electrodelayer and a conductive resin layer has been proposed. In thedouble-layer structure including the electrode layer and the conductiveresin layer, a resin composition, including a conductive material, isapplied onto the electrode layer to absorb external impacts and toprevent permeation of plating liquid. As a result, reliability may beimproved.

However, as electric vehicles, autonomous vehicles, and the like, havebeen developed in the automotive industry, a greater number ofmultilayer ceramic capacitors are required, and multilayer ceramiccapacitors, used in automobiles and the like, are required to havestricter humidity resistance reliability conditions and bending strengthcharacteristics secured therein.

SUMMARY

An aspect of the present disclosure is to provide a multilayerelectronic component having improved bending strength characteristics.

An aspect of the present disclosure is to provide a multilayerelectronic component having improved humidity resistance reliability.

An aspect of the present disclosure is to provide a multilayerelectronic component having low equivalent series resistance (ESR).

However, the objects of the present disclosure are not limited to theabove description, and will be more easily understood in the process ofdescribing specific embodiments of the present disclosure.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body including dielectric layers, andfirst and second internal electrodes alternately stacked with respectivedielectric layers interposed therebetween, and having first and secondsurfaces opposing each other in a stacking direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother, and fifth and sixth surfaces connected to the first to fourthsurfaces and opposing each other. The multilayer electronic componentfurther includes a first external electrode including a first electrodelayer connected to the first internal electrode and a first conductiveresin layer disposed on the first electrode layer, and having a firstconnection portion disposed on the third surface of the body and a firstband portion extending from the first connection portion to a portion ofeach of the first, second, fifth, and sixth surfaces. The multilayerelectronic component further includes a second external electrodeincluding a second electrode layer connected to the second internalelectrode and a second conductive resin layer disposed on the secondelectrode layer, and having a second connection portion disposed on thefourth surface of the body and a second band portion extending from thesecond connection portion to a portion of each of the first, second,fifth, and sixth surfaces. The multilayer electronic component stillfurther includes a silicon (Si) organic compound layer having a bodycover portion disposed on a region of external surfaces of the bodybetween the first and second electrode layers, a first extending portionextending from the body cover portion to a region between the firstelectrode layer and the first conductive resin layer of the first bandportion, and a second extending portion extending from the body coverportion to a region between the second electrode layer and the secondconductive resin layer of the second band portion.

According to another aspect of the present disclosure, a multilayerelectronic component includes a body including dielectric layers, andfirst and second internal electrodes alternately stacked with respectivedielectric layers interposed therebetween, and having first and secondsurfaces opposing each other in a stacking direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother, and fifth and sixth surfaces connected to the first to fourthsurfaces and opposing each other. The multilayer electronic componentfurther includes a first external electrode including a first electrodelayer connected to the first internal electrode and a first conductiveresin layer disposed on the first electrode layer, and having a firstconnection portion disposed on the third surface of the body and a firstband portion extending from the first connection portion to a portion ofeach of the first, second, fifth, and sixth surfaces. The multilayerelectronic component further includes a second external electrodeincluding a second electrode layer connected to the second internalelectrode and a second conductive resin layer disposed on the secondelectrode layer, and having a second connection portion disposed on thefourth surface of the body and a second band portion extending from thesecond connection portion to a portion of each of the first, second,fifth, and sixth surfaces. The multilayer electronic component stillfurther includes a silicon (Si) organic compound layer having a bodycover portion disposed on a region of external surfaces of the bodybetween the first and second electrode layers, a first extending portionextending from the body cover portion to a region between the firstelectrode layer and the first conductive resin layer, and a secondextending portion extending from the body cover portion to a regionbetween the second electrode layer and the second conductive resinlayer. The first and second extending portions have first and secondopenings, respectively.

According to still another aspect of the present disclosure, amultilayer electronic component includes a body including dielectriclayers, and first and second internal electrodes alternately stackedwith respective dielectric layers interposed therebetween in a stackingdirection, the first and second internal electrodes being exposed toopposing end surfaces of the body in a length direction perpendicular tothe stacking direction. The multilayer electronic component furtherincludes first and second external electrodes including first and secondelectrode layers disposed on the end surfaces of the body and connectedto the first and second internal electrodes, respectively, the first andsecond electrode layers further extending inwardly in the lengthdirection along surfaces of the body that connect the end surfaces toeach other. The multilayer electronic component further includes asilicon (Si) organic compound layer disposed to cover exterior surfacesof the body and the first and second electrode layers. The first andsecond external electrodes further include first and second conductiveresin layers enclosing the first and second electrode layers,respectively. The Si organic compound layer has one or more firstopenings between the first electrode layer and the first conductiveresin layer so as to expose the first electrode layer to the firstconductive resin layer through the one or more first openings, and hasone or more second openings between the second electrode layer and thesecond conductive resin layer so as to expose the second electrode layerto the second conductive resin layer through the one or more secondopenings.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment of the presentdisclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 ;

FIG. 3 is a schematic exploded perspective view of a body, in whichdielectric layers and internal electrodes are stacked, according to anexemplary embodiment of the present disclosure;

FIG. 4 is an enlarged view of region P in FIG. 2 ;

FIG. 5 is a schematic perspective view of a multilayer electroniccomponent according to another exemplary embodiment of the presentdisclosure;

FIG. 6 is a cross-sectional view taken along line II-II′ in FIG. 5 ;

FIG. 7 is a schematic perspective view illustrating a modified exampleof a multilayer electronic component according to another exemplaryembodiment of the present disclosure; and

FIG. 8 is a cross-sectional view taken along line III-III′ in FIG. 7 .

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to specific embodiments and the accompanying drawings.However, embodiments of the present disclosure may be modified to havevarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Further, embodiments of thepresent disclosure may be provided for a more complete description ofthe present disclosure to the ordinarily skilled artisan. Therefore,shapes and sizes of the elements in the drawings may be exaggerated forclarity of description, and the elements denoted by the same referencenumerals in the drawings may be the same elements.

In the drawings, portions not related to the description will be omittedfor clarification of the present disclosure, and a thickness may beenlarged to clearly show layers and regions. The same reference numeralswill be used to designate the same components in the same referencenumerals. Further, throughout the specification, when an element isreferred to as “comprising” or “including” an element, it means that theelement may further include other elements as well, without departingfrom the other elements, unless specifically stated otherwise.

In the drawing, an X direction may be defined as a second direction, anL direction, or a longitudinal direction, a Y direction may be definedas a third direction, a W direction, or a width direction, and a Zdirection may be defined as a first direction, a stacking direction, a Tdirection, or a thickness direction.

Multilayer Electronic Component

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment.

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 .

FIG. 3 is a schematic exploded perspective view of a body, in whichdielectric layers and internal electrodes are stacked, according to anexemplary embodiment.

FIG. 4 is an enlarged view of region P in FIG. 2 .

Hereinafter, a multilayer electronic component 100 according to anexemplary embodiment will be described with reference to FIGS. 1 to 4 .

A multilayer electronic component 100 according to an exemplaryembodiment may include a body 110 including dielectric layers 111, andfirst and second internal electrodes 121 and 122 alternately stackedwith respective dielectric layers interposed therebetween, and havingfirst and second surfaces 1 and 2 opposing each other in a stackingdirection, third and fourth surfaces 3 and 4 connected to the first andsecond surfaces 1 and 2 and opposing each other, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and4 and opposing each other. The multilayer electronic component 100 mayfurther include a first external electrode 131 including a firstelectrode layer 131 a connected to the first internal electrode 121 anda first conductive resin layer 131 b disposed on the first electrodelayer 131 a, and having a first connection portion A1 disposed on thethird surface 3 of the body 110 and a first band portion B1 extendingfrom the first connection portion A1 to a portion of each of the first,second, fifth, and sixth surfaces 1, 2, 5, and 6. The multilayerelectronic component 100 may further include a second external electrode132 including a second electrode layer 132 a connected to the secondinternal electrode 122 and a second conductive resin layer 132 bdisposed on the second electrode layer 132 a, and having a secondconnection portion A2 disposed on the fourth surface 4 of the body 110and a second band portion B2 extending from the second connectionportion A2 to a portion of each of the first, second, fifth, and sixthsurfaces 1, 2, 5, and 6. The multilayer electronic component 100 maystill further include a silicon (Si) organic compound layer 140 having abody cover portion 143 disposed on a region of external surfaces of thebody 110 between the first and second electrode layers 131 a and 132 a,a first extending portion 141 disposed to extend from the body coverportion 143 between the first electrode layer 131 a and the firstconductive resin layer 131 b of the first band portion B1, and a secondextending portion 142 disposed to extend from the body cover portion 143between the second electrode layer 132 a and the second conductive resinlayer 132 b of the second band portion B2.

In the body 110, the dielectric layers 111 and the internal electrodes121 and 122 are alternately stacked.

The body 110 is not limited in shape, but may have a hexahedral shape ora shape similar thereto. Due to shrinkage of ceramic powder particlesincluded in the body 110 during sintering, the body 110 may have asubstantially hexahedral shape rather than a hexahedral shape havingcomplete straight lines.

The body 110 may have the first and second surfaces 1 and 2 opposingeach other in a thickness direction (a Z direction), the third andfourth surfaces 3 and 4 connected to the first and second surfaces 1 and2 and opposing each other in a width direction (a Y direction), and thefifth and sixth surfaces 5 and 6 connected to the first and secondsurfaces 1 and 2 and as well as to the third and fourth surfaces 3 and 4and opposing each other in a length direction (an X direction).

The plurality of dielectric layers 111, constituting the body 110, is ina sintered state and may be integrated with each other such thatboundaries therebetween may not be readily apparent without using ascanning electron microscope (SEM).

According to an exemplary embodiment, a raw material forming thedielectric layer 111 is not limited as long as sufficient capacitancemay be obtained. For example, a barium titanate-based material, a leadcomposite perovskite-based material, a strontium titanate-basedmaterial, or the like, may be used.

Various ceramic additives, organic solvents, plasticizers, binders,dispersants, or the like may be added to the powder of barium titanate(BaTiO₃), and the like, according to the purpose of the presentdisclosure, as the material for forming the dielectric layer 111.

The body 110 may have a capacitance forming portion disposed in the body110 and including the first and second internal electrodes 121 and 122,disposed to oppose each other with the dielectric layer 111 interposedtherebetween, to form capacitance, and upper and lower protective layers112 and 113 disposed above and below the capacitance forming portion.

The capacitance forming portion may contribute to capacitance formationof a capacitor, and may be formed by repeatedly laminating the pluralityof first and second internal electrodes 121 and 122 with the dielectriclayer 111 interposed therebetween.

The upper protective layer 112 and the lower protective layer 113 may beformed by laminating a single dielectric layer or two or more dielectriclayers on upper and lower surfaces of the capacitance forming portion,respectively, in the vertical direction, and may basically play a rolein preventing damage to the internal electrodes due to physical orchemical stress.

The upper protective layer 112 and the lower protective layer 113 maynot include an internal electrode, and may include the same material asthe dielectric layer 111.

The plurality of internal electrodes 121 and 122 may be disposed tooppose each other with the dielectric layer 111 interposed therebetween.

The internal electrodes 121 and 122 may include first and secondinternal electrodes 121 and 122 alternately disposed to oppose eachother with respective dielectric layers interposed therebetween.

The first and second internal electrodes 121 and 122 may be exposed tothe third and fourth surfaces 3 and 4, respectively.

Referring to FIG. 2 , the first internal electrode 121 may be spacedapart from the fourth surface 4 and may be exposed through the thirdsurface 3, and the second internal electrode 122 may be spaced apartfrom the third surface 3 and may be exposed through the fourth surface4. The first external electrode 131 may be disposed on the third surface3 of the body 110 to be connected to the first internal electrode 121,and the second external electrode 132 may be disposed on the fourthsurface 4 of the body 110 to be connected to the second internalelectrode 122.

For example, the first internal electrode 121 is not connected to thesecond external electrode 132 and is connected to the first externalelectrode 131, and the second internal electrode 122 is not connected tothe first external electrode 131 and is connected to the second externalelectrode 132. Thus, the first internal electrode 121 is formed to bespaced apart from the fourth surface 4 by a predetermined distance, andthe second internal electrode 122 is formed to be spaced apart from thethird surface 3 by a predetermined distance.

The first and second internal electrodes 121 and 122 may be electricallyisolated from each other by the dielectric layer 111 disposedtherebetween.

Referring to FIG. 3 , the body 110 may be formed by alternatelylaminating the dielectric layer 111, on which the first internalelectrode 121 is printed, and the dielectric layer 111, on which thesecond internal electrode 122 is printed, in a thickness direction (a Zdirection) and sintering the dielectric layers 111.

The material forming the first and second internal electrodes 121 and122 is not limited. For example, the first and second internalelectrodes 121 and 122 may be formed using a conductive paste containinga noble metal material such as palladium (Pd), a palladium-silver(Pd—Ag) alloy, or the like, nickel (Ni), and copper (Cu).

A method of printing the conductive paste may be a screen-printingmethod, a gravure printing method, or the like, but is not limitedthereto.

The external electrodes 131 and 132 are disposed on the body 110 andinclude electrode layers 131 a and 132 a and conductive resin layers 131b and 132 b.

The external electrodes 131 and 132 may include first and secondexternal electrodes 131 and 132, respectively connected to the first andsecond internal electrodes 121 and 122.

The first external electrode 131 includes a first electrode layer 131 aand a first conductive resin layer 131 b, and the second externalelectrode 132 includes a second electrode layer 132 a and a secondconductive resin layer 132 b.

When the first external electrode 131 is divided depending on a positionin which it is disposed, the first external electrode 131 has a firstconnection portion A1, disposed on the third surface 3 of the body, anda band portion B1 extending from the first connection portion A1 to aportion of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6.

When the second external electrode 132 is divided depending on aposition in which it is disposed, the second external electrode 132 hasa second connection portion A2, disposed on the fourth surface 4 of thebody, and a band portion B2 extending from the second connection portionA2 to a portion of the first, second, fifth, and sixth surfaces 1, 2, 5,and 6.

The first and second electrode layers 131 a and 132 a may be formedusing any material as long as it is a material having electricalconductivity such as a metal or the like, and a specific material may bedetermined in consideration of electrical characteristics, structuralstability, and the like.

For example, the first and second electrode layers 131 a and 132 a mayinclude a conductive metal and glass.

A conductive metal, used for the electrode layers 131 a and 132 a, isnot limited as long as it may be electrically connected to the internalelectrodes 121 and 122 to form capacitance and may include at least oneselected from the group consisting of, for example, copper (Cu), silver(Ag), nickel (Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste, prepared by adding a glass frit, to the conductivemetal powder particles and sintering the conductive paste.

When the first and second electrode layers 131 a and 132 a include aconductive metal and glass, corner portions, at which the connectionportions A1 and A2 and the band portions B1 and B2 meet, may be formedto be thin, or lifting may occur between ends of the band portions B1and B2 and the body 110. Therefore, since humidity resistancereliability may be problematic, an effect of improving the humidityreliability may be more effective when the first and second electrodelayers 131 a and 132 a include a conductive metal and glass.

The first and second electrode layers 131 a and 132 a may be formed bymeans of atomic layer deposition (ALD), molecular layer deposition(MLD), chemical vapor deposition (CVD) sputtering, or the like.

In addition, the electrode layers 131 a and 132 a may include aconductive metal and glass.

The conductive resin layers 131 b and 132 b may include a conductivemetal and a base resin.

The conductive metal, included in the conductive resin layers 131 b and132 b, serves to electrically connect the conductive resin layers 131 band 132 b to the electrode layers 131 a and 132 a.

The conductive metal, included in the conductive resin layers 131 b and132 b, is not limited as long as it may be electrically connected to theelectrode layers 131 a and 132 a and may include at least one selectedfrom the group consisting of, for example, copper (Cu), silver (Ag),nickel (Ni), and alloys thereof.

The conductive metal, included in the conductive resin layers 131 b and132 b, may include at least one of spherical powder particles and flakepowder particles. For example, the conductive metal may include onlyflake powder particles, or spherical powder particles, or a mixture offlake powder particles and spherical powder particles.

The spherical powder particles may have an incompletely spherical shapeand may have, for example, a shape in which a ratio of a length of amajor axis to a length of a minor axis (the major axis/the minor axis)is 1.45 or less.

The flake powder particles refer to powder particles, each having a flatand elongated shape, and is not limited to a specific shape and, forexample, a ratio of a length of a major axis and a length of a minoraxis (the major axis/the minor axis) may be 1.95 or more.

The lengths of the major axes and the minor axes of the spherical powderparticles and the flake powder particles may be measured from an imageobtained by scanning a cross section (an L-T cross section), taken froma central portion of a multilayer electronic component in a width (Y)direction, in X and Z directions with a scanning electron microscope(SEM).

The base resin, included in the conductive resin layers 131 b and 132 b,serves to secure adhesion and to absorb impact.

The base resin, included in the conductive resin layers 131 b and 132 b,is not limited as long as it has adhesion and impact absorption and ismixed with conductive metal powder particles to prepare a paste and mayinclude, for example, an epoxy-based resin.

The first external electrode 131 may further include first platinglayers 131 c and 131 d disposed on the first conductive resin layers 131b, and the second external electrode 132 may further include secondplating layers 132 c and 132 d disposed on the second conductive resinlayer 132 b.

The first and second plating layers 131 c, 131 d, 132 c, and 132 d serveto improve mounting characteristics.

The first and second plating layers 131 c, 131 d, 132 c, and 132 d maybe Ni plating layers or Sn plating layers, or may include Ni platinglayers 131 c and 132 c and Sn plating layers 131 d and 132 d,respectively and sequentially formed on the first and second conductivelayers 131 b and 132 b. Alternatively, the first and second platinglayers 131 c, 131 d, 132 c, and 132 d may include a plurality of Niplating layers and/or a plurality of Sn plating layers.

A silicon (Si) organic compound layer 140 has a body cover portion 143disposed in a region, in which the first and second electrode layers 131a and 132 a are not disposed, of external surfaces of the body 110, afirst extending portion 141 disposed to extend from the body coverportion 143 between the first electrode layer 131 a and the firstconductive resin layer 131 b of the first band portion B1, and a secondextending portion 142 disposed to extend from the body cover portion 143between the second electrode layer 132 a and the second conductive resinlayer 132 b of the second band portion B2.

The Si organic compound layer 140 serves to prevent stress, generatedwhen a substrate is deformed by thermal and physical impacts while themultilayer electronic component 100 is mounted on the substrate, frompropagating to the body 110 and to prevent cracking.

In addition, the Si organic compound layer 140 serves to improvehumidity resistance by blocking a humidity permeation path.

The base resin, included in the conductive resin layers 131 b and 132 b,also plays a role in absorbing impacts, but the role of the base resinis limited because the first conductive resin layer 131 b and the secondconductive resin layer 132 b must be disposed to be insulated.

Meanwhile, since the body cover portion 143 does not include aconductive metal and is disposed in the region, in which the first andsecond electrode layers 131 a and 132 a are not disposed, of theexternal surface of the body 110, the body cover portion 143 is disposedin a wider region to be more effective in absorbing impact andsuppressing stress propagation.

In addition, the body cover part 143 may prevent humidity frompermeating into the body 110 through the external surface of the body100 by sealing fine pores or cracking of the body 110.

The first extending portion 141 is disposed to extend from the bodycover portion 143 between the first electrode layer 131 a and the firstconductive resin layer 131 b of the first band part B1, serving tosuppress stress propagation to the body 110 and to prevent cracking.

In addition, the first extending portion 141 serves to suppress liftingbetween an end of the first electrode layer 131 a, disposed on the firstband portion B1, and the body 110 to improve humidity resistancereliability.

The second extending portion 142 is disposed to extend from the bodycover portion 143 between the second electrode layer 132 a and thesecond conductive resin layer 132 b of the second band portion B2,serving to suppress stress propagation to the body 110 and to preventcracking.

In addition, the second extension portion 142 serves to improve humidityresistance reliability by suppressing lifting between an end of thesecond electrode layer 132 a, disposed in the second band portion B2,and the body 110.

The Si organic compound layer 140 may be formed by forming the first andsecond electrode layers 131 a and 132 a in the body 110 includingdielectric layers and internal electrodes, forming a silicon (Si)organic compound layer 140 on an exposed external surface of the body110 and the connection portions A1 and A2 of the first and secondelectrode layers 131 a and 132 a, and removing the Si organic compoundlayer 140 formed on the connection portions A1 and A2 of the first andsecond electrode layers 131 a and 132 a.

A method of removing the organic compound layer 140 may be, for example,laser processing, mechanical polishing, dry etching, wet etching,shadowing deposition using a tape protective layer, or the like.

The Si organic compound layer 140 may include alkoxy silane.

Accordingly, the Si organic compound layer 140 has a polymeric formincluding a plurality of silicon carbide bonding structures, and hashydrophobicity.

The alkoxy silane prevents humidity permeation and contamination, andpermeates into various inorganic substrates and is then cured to protectproducts and to increase durability. In addition, the alkoxy silane mayreact with a hydroxyl group (OH), and thus, may form a strong chemicalbond to improve durability.

As compared with an epoxy resin or an inorganic compound, the epoxyresin is difficult to effectively suppress humidity permeation becauseit has no water repellent effect, a large amount of CO₂ gas may begenerated during curing to cause lifting, and the inorganic compound hasno functional group capable of reacting with a hydroxyl group whenapplied to a surface of the body 110, and thus, it is difficult toadhere to the surface of the body 110 and a chemical bond is not formed.Accordingly, it may be difficult to apply the epoxy resin or theinorganic compound to the present disclosure.

Therefore, as the Si organic compound layer 140 may include alkoxysilane, an effect of sealing fine pores or cracking may be furtherimproved and bending stress and humidity resistance reliability may befurther improved.

When a thickness of the first conductive resin layer 131 b on the firstelectrode layer 131 a of the first band portion B1 is defined as Ta anda thickness of the first extending portion 141 is defined as Tb, Tb/Tamay be 0.5 or more to 0.9 or less.

FIG. 4 is an enlarged view of region P in FIG. 2 . Referring to FIG. 4 ,thicknesses of the first conductive resin layer 131 b and the firstextending portion 141 on the first electrode layer 131 a of the firstband portion B1 will be described in detail. However, the above detaileddescription may be identically applied to thicknesses of the secondconductive resin layer 132 b and the second extending portion 142 on thesecond electrode layer 132 a of the second band portion B2.

After preparing sample chips while changing the ratio of the thicknessTb of the first extending portion 141 to the thickness Ta of the firstconductive resin layer 131 b on the first electrode layer 131 a of thefirst band portion B1 (Tb/Ta), bending strength and equivalent seriesresistance (ESR) were evaluated, and the results are shown in Tables 1and 2, respectively.

The bending strength was measured using a bending strength measuringmethod through a piezoelectric effect. After mounting samples of amultilayer ceramic capacitor on a substrate, a distance from a centralportion pressed during bending was set to be 6 mm to observe whethercracking occurs in the sample chips. The number of sample chips, inwhich cracking occurred, to the total number of sample chips is shown.

According to the ESR evaluation, a sample chip was maintained at atemperature of −55° C. for 30 minutes and increased to a temperature of125° C. and was then maintained for 30 minutes, which was one cycle.After 500 cycles were applied, a sample having ESR greater than 50 mΩwas determined to be defective. The number of sample chips havingdefective ESR to the total number of sample chips was shown.

TABLE 1 Bending Strength Evaluation No. Tb/Ta A Lot B Lot C Lot D Lot ELot Sum 1 0.3 1/60 0/60 0/60 2/60 0/60 3/300 2 0.5 0/60 0/60 0/60 0/600/60 0/300 3 0.7 0/60 0/60 0/60 0/60 0/60 0/300 4 0.9 0/60 0/60 0/600/60 0/60 0/300 5 1.1 0/60 0/60 0/60 0/60 0/60 0/300 6 1.3 0/60 0/600/60 0/60 0/60 0/300

Referring to Table 1, in Test No. 1 in which Tb/Ta was 0.3, crackingoccurred in three sample chips among a total of 300 sample chips.

On the other hand, in Test Nos. 2 to 6 in which Tb/Ta was 0.5 or more,there was no sample chip in which cracking occurred. Accordingly,bending strength was excellent.

TABLE 2 ESR Evaluation No. Tb/Ta A Lot B Lot C Lot D Lot E Lot Sum 1 0.30/320 0/320 0/320 0/320 0/320  0/1600 2 0.5 0/320 0/320 0/320 0/3200/320  0/1600 3 0.7 0/320 0/320 0/320 0/320 0/320  0/1600 4 0.9 0/3200/320 0/320 0/320 0/320  0/1600 5 1.1 5/320 0/320 3/320 0/320 3/32011/1600 6 1.3 0/320 7/320 2/320 0/320 0/320  9/1600

Referring to Table 2, in Test No. 5 in which Tb/Ta was 1.1, an ESRdefect occurred in eleven sample chips among a total of 1600 samplechips. In Test No. 6 in which Tb/Ta was 1.3, an ESR defect occurred innine sample chips among a total of 1600 sample chips.

On the other hand, In Test Nos. 1 to 4 in which Tb/Ta was 0.9 or less,there was no sample chip in which an ESR defect occurred. Accordingly,ESR characteristics were excellent.

Therefore, to secure excellent ESR characteristics while improvingbending strength, the ratio of the thickness Tb of the first extendingportion 141 to the thickness Ta of the first conductive resin layer 131b on the first electrode layer 131 a of the first band portion B1(Tb/Ta) may be, in detail, 0.5 or more to 0.9 or less.

FIG. 5 is a schematic perspective view of a multilayer electroniccomponent according to another exemplary embodiment.

FIG. 6 is a cross-sectional view taken along line II-II′ in FIG. 5 .

FIG. 7 is a schematic perspective view illustrating a modified exampleof a multilayer electronic component according to another exemplaryembodiment.

FIG. 8 is a cross-sectional view taken along line III-III′ in FIG. 7 .

Hereinafter, a multilayer electronic component 100′ according to anotherexemplary embodiment 100′ and a modified example 100″ thereof will bedescribed with reference to FIGS. 5 to 8 . However, descriptions commonto the multilayer electronic component 100 according to the embodimentwill be omitted to avoid duplicate descriptions.

A multilayer electronic component 100′ according to an exemplaryembodiment may include a body 110 including dielectric layers 111, andfirst and second internal electrodes 121 and 122 alternately stackedwith respective dielectric layers interposed therebetween, and havingfirst and second surfaces 1 and 2 opposing each other in a stackingdirection, third and fourth surfaces 3 and 4 connected to the first andsecond surfaces 1 and 2 and opposing each other, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and4 and opposing each other. The multilayer electronic component 100′ mayfurther include a first external electrode 131 including a firstelectrode layer 131 a connected to the first internal electrode 121 anda first conductive resin layer 131 b disposed on the first electrodelayer 131 a, and having a first connection portion C1 disposed on thethird surface 3 of the body 110 and a first band portion B1 extendingfrom the first connection portion C1 to a portion of each of the first,second, fifth, and sixth surfaces 1, 2, 5, and 6. The multilayerelectronic component 100′ may further include a second externalelectrode 132 including a second electrode layer 132 a connected to thesecond internal electrode 122 and a second conductive resin layer 132 bdisposed on the second electrode layer 132 a, and having a secondconnection portion C2 disposed on the fourth surface 4 of the body 110and a second band portion B2 extending from the second connectionportion C2 to a portion of each of the first, second, fifth, and sixthsurfaces 1, 2, 5, and 6. The multilayer electronic component 100′ maystill further include a silicon (Si) organic compound layer 140′ havinga body cover portion 143 disposed in a region, in which the first andsecond electrode layers 131 a and 132 a are not disposed, of externalsurfaces of the body 110, a first extending portion 141′ disposed toextend from the body cover portion 143 between the first electrode layer131 a and the first conductive resin layer 132 b, and a second extendingportion 142′ disposed to extend from the body cover portion 143 betweenthe second electrode layer 132 a and the second conductive resin layer132 b. The first and second extending portions 141′ and 142′ have firstand second openings H1 and H2, respectively.

The first conductive resin layer 131 b may be in contact with the firstelectrode layer 131 a through the first opening H1, and the secondconductive resin layer 132 b may be in contact with the second electrodelayer 132 a through the second opening H2. For example, the firstopening H1 may be filled with the first conductive resin layer 131 b,and the second opening H2 may be filled with the second conductive resinlayer 132 b.

The Si organic compound layer 140′ may be formed by forming the firstand second electrode layers 131 a and 132 a in the body 110 includingdielectric layers and internal electrodes, forming a silicon (Si)organic compound layer on an exposed external surface of the body 110and the first and second electrode layers 131 a and 132 a, and removinga portion of the Si organic compound layer formed on the first andsecond electrode layers 131 a and 132 a to form the first and secondopenings H1 and H2.

A method of removing a region, in which the openings H1 and H2 to beformed, may be, for example, laser processing, mechanical polishing, dryetching, wet etching, shadowing deposition using a tape protectivelayer, or the like.

In this case, an area of the first opening H1 may be 20 to 90% of anarea of the first extending portion 141′, an area of the second openingH2 may be 20 to 90% of an area of the second extending portion 142′.

When the area of the first opening H1 is less than 20% of the area ofthe first extending portion 141′, electrical connectivity between thefirst electrode layer 131 a and the first conductive resin layer 131 bis deteriorated to increase ESR. On the other hand, when the area of thefirst opening H1 is greater than 90% of the area of the first extensionportion 141′, an effect of improving bending strength and humidityresistance reliability of the Si organic compound layer 140′ may beinsufficient.

When the area of the second opening H2 is less than 20% of the area ofthe second extending portion 142′, electrical connectivity between thesecond electrode layer 132 a and the second conductive resin layer 132 bmay be deteriorated to increase ESR. On the other hand, when the area ofthe second opening H2 is greater than 90% of the area of the secondextending portion 142′, an effect of improving the bending strength andthe humidity resistance reliability of the Si organic compound layer140′ may be insufficient.

The first opening H1 may be disposed in any one or more of the firstband portion B1 and the first connection portion C1 of the firstelectrode layer, and the second opening H2 may be disposed in any one ormore of the second band portion B2 and the second connection portion C2.

As illustrated in FIG. 6 , the first extending portion 141′ may have aform in which the first opening portion H1 is only disposed in the firstconnecting portion A1, and the second extending portion 142′ may have aform in which a second opening portion H2 is only disposed in the secondconnection portion C2.

In addition, as illustrated in FIG. 8 , a multilayer electroniccomponent 100″ according to another exemplary embodiment may include asilicon (Si) organic compound layer 140″ having a body cover portion 143disposed in a region, in which the first and second electrode layers 131a and 132 a are not disposed, of external surfaces of the body 110, afirst extending portion 141″ disposed to extend from the body coverportion 143 between the first electrode layer 131 a and the firstconductive resin layer 131 b, and a second extending portion 142″disposed to extend from the body cover portion 143 between the secondelectrode layer 132 a and the second conductive resin layer 132 b. Thefirst extending portion 141″ may have a form in which the first openingportion H1 is disposed in both the first connection portion C1 and thefirst band portion B1, and the second extending portion 142″ may have aform in which the second opening H2 is disposed in both the secondconnection portion C2 and the second band portion B2.

The shape and the number of the openings H1 and H2 are not limited, andeach of the openings H1 and H2 may have a shape such as a circle, arectangle, an ellipse, a rectangle having rounded corners, and the like,and may have an irregular shape.

As described above, a multilayer electronic component may include asilicon (Si) organic compound layer having a body cover portion disposedin a region, in which electrode layers are not disposed, of externalsurfaces of a body, and an extending portion disposed to extend from thebody cover portion between an electrode layer and a conductive resinlayer of an external electrode, and thus, may improve bending strength.

In addition, the Si organic compound layer may be provided to improvehumidity resistance reliability.

While embodiments have been shown and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: abody including dielectric layers, and first and second internalelectrodes alternately stacked with respective dielectric layersinterposed therebetween, the body having first and second surfacesopposing each other in a stacking direction, third and fourth surfacesconnected to the first and second surfaces and opposing each other, andfifth and sixth surfaces connected to the first to fourth surfaces andopposing each other; a first external electrode including a firstelectrode layer connected to the first internal electrode and a firstconductive resin layer disposed on the first electrode layer, the firstexternal electrode having a first connection portion disposed on thethird surface of the body and a first band portion extending from thefirst connection portion to a portion of each of the first, second,fifth, and sixth surfaces; a second external electrode including asecond electrode layer connected to the second internal electrode and asecond conductive resin layer disposed on the second electrode layer,the second external electrode having a second connection portiondisposed on the fourth surface of the body and a second band portionextending from the second connection portion to a portion of each of thefirst, second, fifth, and sixth surfaces; and a silicon (Si) organiccompound layer having a body cover portion disposed on a region ofexternal surfaces of the body between the first and second electrodelayers, a first extending portion extending from the body cover portionto a region between the first electrode layer and the first conductiveresin layer of the first band portion, and a second extending portionextending from the body cover portion to a region between the secondelectrode layer and the second conductive resin layer of the second bandportion, wherein at least one of the first extending portion of thefirst band portion or the second extending portion of the second bandportion has openings, and the first extending portion covers an end ofthe first electrode layer, and the second extending portion covers anend of the second electrode layer.
 2. The multilayer electroniccomponent of claim 1, wherein the Si organic compound layer includesalkoxy silane.
 3. The multilayer electronic component of claim 1,wherein the first and second conductive resin layers include aconductive metal and a base resin.
 4. The multilayer electroniccomponent of claim 1, wherein the first and second electrode layersinclude a conductive metal and glass.
 5. The multilayer electroniccomponent of claim 1, wherein the first external electrode furtherincludes a first plating layer disposed on the first conductive resinlayer, and the second external electrode further includes a secondplating layer disposed on the second conductive resin layer.
 6. Themultilayer electronic component of claim 1, wherein the first extendingportion does not extend between the first electrode layer and the firstconductive resin layer of the first connection portion, and the secondextending portion does not extend between the second electrode layer andthe second conductive resin layer of the second connection portion. 7.The multilayer electronic component of claim 1, wherein the Si organiccompound layer is disposed on the first, second, fifth, and sixthsurfaces of the body.
 8. The multilayer electronic component of claim 7,wherein the Si organic compound layer is disposed on the first electrodelayer of the first connection portion and disposed on the secondelectrode layer of the second connection portion.
 9. A multilayerelectronic component comprising: a body including dielectric layers, andfirst and second internal electrodes alternately stacked with respectivedielectric layers interposed therebetween, the body having first andsecond surfaces opposing each other in a stacking direction, third andfourth surfaces connected to the first and second surfaces and opposingeach other, and fifth and sixth surfaces connected to the first tofourth surfaces and opposing each other; a first external electrodeincluding a first electrode layer connected to the first internalelectrode and a first conductive resin layer disposed on the firstelectrode layer, the first external electrode having a first connectionportion disposed on the third surface of the body and a first bandportion extending from the first connection portion to a portion of eachof the first, second, fifth, and sixth surfaces; a second externalelectrode including a second electrode layer connected to the secondinternal electrode and a second conductive resin layer disposed on thesecond electrode layer, the second external electrode having a secondconnection portion disposed on the fourth surface of the body and asecond band portion extending from the second connection portion to aportion of each of the first, second, fifth, and sixth surfaces; and asilicon (Si) organic compound layer having a body cover portion disposedon a region of external surfaces of the body between the first andsecond electrode layers, a first extending portion extending from thebody cover portion to a region between the first electrode layer and thefirst conductive resin layer, and a second extending portion extendingfrom the body cover portion to a region between the second electrodelayer and the second conductive resin layer, wherein the first andsecond extending portions have first and second openings, respectively,wherein at least one of the first extending portion of the first bandportion or the second extending portion of the second band portion hasadditional openings, and the first extending portion covers an end ofthe first electrode layer, and the second extending portion covers anend of the second electrode layer.
 10. The multilayer electroniccomponent of claim 9, wherein the first conductive resin layer is incontact with the first electrode layer through the first opening, andthe second conductive resin layer is in contact with the secondelectrode layer through the second opening.
 11. The multilayerelectronic component of claim 9, wherein an area of the first opening is20 to 90% of an area of the first extending portion, and an area of thesecond opening is 20 to 90% of an area of the second extending portion.12. The multilayer electronic component of claim 9, wherein the firstopening is disposed in at least one of the first band portion or thefirst connection portion, and the second opening is disposed in at leastone of the second band portion or the second connection portion.
 13. Themultilayer electronic component of claim 9, wherein the Si organiccompound layer includes alkoxy silane.
 14. The multilayer electroniccomponent of claim 9, wherein the first and second conductive resinlayers include a conductive metal and a base resin.
 15. The multilayerelectronic component of claim 9, wherein the first and second electrodelayers include a conductive metal and glass.
 16. The multilayerelectronic component of claim 9, wherein the first external electrodefurther includes a first plating layer disposed on the first conductiveresin layer, and the second external electrode further includes a secondplating layer disposed on the second conductive resin layer.
 17. Themultilayer electronic component of claim 9, wherein the Si organiccompound layer is disposed on the first, second, fifth, and sixthsurfaces of the body.
 18. The multilayer electronic component of claim17, wherein the Si organic compound layer is disposed on the firstelectrode layer of the first connection portion and disposed on thesecond electrode layer of the second connection portion.
 19. Amultilayer electronic component comprising: a body including dielectriclayers, and first and second internal electrodes alternately stackedwith respective dielectric layers interposed therebetween in a stackingdirection, the first and second internal electrodes being exposed toopposing end surfaces of the body in a length direction perpendicular tothe stacking direction; first and second external electrodes includingfirst and second electrode layers disposed on the end surfaces of thebody and connected to the first and second internal electrodes,respectively, the first and second electrode layers further extendinginwardly in the length direction along surfaces of the body that connectthe end surfaces to each other; and a silicon (Si) organic compoundlayer disposed to cover exterior surfaces of the body and the first andsecond electrode layers, wherein the first and second externalelectrodes further include first and second conductive resin layersenclosing the first and second electrode layers, respectively, whereinthe Si organic compound layer has one or more first openings between thefirst electrode layer and the first conductive resin layer so as toexpose the first electrode layer to the first conductive resin layerthrough the one or more first openings, and has one or more secondopenings between the second electrode layer and the second conductiveresin layer so as to expose the second electrode layer to the secondconductive resin layer through the one or more second openings, whereinthe Si organic compound layer has first and second band portionsextending between the first and second electrode layers and the firstand second conductive resin layers, respectively, on at least one offirst and second surfaces of the body opposing each other in thestacking direction, and at least one of the first and second bandportions of the Si organic compound layer includes additional openings,and wherein the first extending portion covers an end of the firstelectrode layer, and the second extending portion covers an end of thesecond electrode layer.
 20. The multilayer electronic component of claim19, wherein the one or more first openings and the one or more secondopenings are provided as a plurality of discrete openings spaced apartfrom one another.
 21. The multilayer electronic component of claim 19,wherein the one or more first and second openings are arranged in onlyregions corresponding to the end surfaces of the body in the lengthdirection.
 22. The multilayer electronic component of claim 19, whereinthe one or more first openings are arranged in an entire region betweenthe first electrode layer and the first conductive resin layer, andwherein the one or more second openings are arranged in an entire regionbetween the second electrode layer and the second conductive resinlayer.
 23. The multilayer electronic component of claim 19, wherein theSi organic compound layer is disposed on the surfaces of the body thatconnect the end surfaces to each other.
 24. The multilayer electroniccomponent of claim 23, wherein the Si organic compound layer is disposedon portions of the first and second electrode layers in the lengthdirection.